| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means for easily improving an adhesion strength of wire bonding or bump connection after a probe inspection step to reduce failures in connection, so as to improve reliability. <P>SOLUTION: Before a wire bonding ball or a bump is formed, a probing chip flattening probe 5b is brought into contact so that the probe slides reversely to a sliding direction of a measuring probe and through a probe trace terminal point of the measuring probe. Thus, probing chips 3a and 3b generated during a probe inspection step can be flattened. Since the adhesion strength of the wire bonding ball or the bump is improved as a result, failures in connection can be easily reduced and reliability can be improved. <P>COPYRIGHT: (C)2010,JPO&INPIT |
