发明名称 NEGATIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a negative resist composition for immersion exposure capable of forming a resist film with high hydrophobicity of the film surface and having good lithography characteristics, and a method of forming a resist pattern using the negative resist composition for immersion exposure. <P>SOLUTION: The negative resist composition for immersion exposure is characterized by including a fluorine-containing polymeric compound (F) containing a structural unit having a base dissociable group, an alkali-soluble resin component (A) excluding the fluorine-containing polymeric compound (F), an acid generator component (B) that generates acid upon exposure, and a crosslinking component (C). The method of forming a resist pattern includes processes for forming a resist film on a substrate using the negative resist composition for immersion exposure, subjecting the resist film to immersion exposure, and forming a resist pattern by subjecting the resist film to alkali developing. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009288771(A) 申请公布日期 2009.12.10
申请号 JP20090023627 申请日期 2009.02.04
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ABE SHO
分类号 G03F7/038;C08F212/14;C08F220/22;G03F7/004;G03F7/38;H01L21/027 主分类号 G03F7/038
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