| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wet processing method and a wet processing device that simplify a configuration and reduce processing costs when the pattern of a circuit etc., is formed on the substrate of silicon etc., and prevent dirt of photoresist, a metal film, etc., peeled from the silicon substrate from re-sticking on the silicon substrate. Ž<P>SOLUTION: After the silicon substrate S is set on a spin step 2 which stores an incombustible liquid L removing the photoresist and metal film from the silicon substrate S and the incombustible liquid L is put in the spin step 2 to dip the silicon substrate S in the incombustible liquid L, the ultrasonic horn 3C of a horn type ultrasonic wave generator 3 is opposed to the surface of the silicon substrate S at a proper interval in the incombustible liquid L, the surface of the silicon substrate S is irradiated with an ultrasonic wave, and then the spin step 2 is rotated around its center to discharge the photoresist and metal film removed from the silicon substrate S to outside the spin step 2 together with the incombustible liquid L. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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