| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which produces no undercutting phenomenon at the bottom of a wiring circuit even if a treatment with an etching solution containing sulfuric acid and hydrogen peroxide is carried out, and a copper foil which can prevent any occurrence of the concerned phenomenon. SOLUTION: In order to reach the object, a surface treated layer containing a zinc component and a transition metal component except zinc, able to take ionic valencies of three kinds or less is provided on a boundary face of an insulated resin layer and a copper layer of a copper clad laminate for manufacturing the printed wiring board in which the copper layer and the insulated resin layer are glued together, and the copper clad laminate in which the surface roughness (Rzjis) of the boundary face of the copper layer with the insulated resin layer is 2.5μm or less is adopted. Further, the surface-treated copper foil 1 provided with a surface-treated layer 3 which contains the zinc component and the transition metal component except zinc, able to take the ionic valencies of three kinds or less on the surface of the copper foil 2, and includes the surface roughness (Rzjis) of 2.5μm or less is adopted for manufacturing the copper clad laminate. COPYRIGHT: (C)2010,JPO&INPIT
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