| 摘要 |
PROBLEM TO BE SOLVED: To provide a moisture-curable hot melt adhesive having excellent solidification capability at a low temperature and a small solidification shrinkage factor that gives a uniform laminate surface lasting even after solidification and does not degrade cutting nature of a laminate. SOLUTION: The moisture-curable hot melt adhesive contains a urethane polymer having an isocyanate group at a terminal, wherein the urethane polymer has a bisphenol structure and a structure derived from a 10-18C aliphatic dicarboxylic acid. The moisture-curable hot melt adhesive is used to stick a decorative panel on a substrate to favorably produce a laminate. The obtained laminate may be favorably used for an IC card or the like. COPYRIGHT: (C)2010,JPO&INPIT |
