发明名称 Wired circuit board and electronic device
摘要 A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
申请公布号 US2009301775(A1) 申请公布日期 2009.12.10
申请号 US20090461576 申请日期 2009.08.17
申请人 NITTO DENKO CORPORATION 发明人 HU SZU-HAN;HO VOON YEE;YAMAZAKI HIROSHI;MCCASLIN MARTIN JOHN
分类号 H05K5/00 主分类号 H05K5/00
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