发明名称 Electronic Apparatus Cooling Device
摘要 A compact, low-cost electronic apparatus cooling device which provides a high heat receiving performance with less transfer of the heat of an exothermic body to a pump. In the device, a heat receiving part has fins in a given area of a plate-like base and the height of the fins is almost equal to the thickness of the base which surrounds them. A pressure member with an opening covers part of the top of the fins and part of the base. Refrigerant flows in from part of the top of the fins in contact with the opening of the pressure member and flow out from part of the top of the fins not covered by the pressure member.
申请公布号 US2009301692(A1) 申请公布日期 2009.12.10
申请号 US20090421749 申请日期 2009.04.10
申请人 OIKAWA HIRONORI 发明人 OIKAWA HIRONORI
分类号 F28D15/00 主分类号 F28D15/00
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