发明名称 Printed circuit board including electronic component embedded therein and method of manufacturing the same
摘要 Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.
申请公布号 US2009301766(A1) 申请公布日期 2009.12.10
申请号 US20080219441 申请日期 2008.07.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK HWA SUN;CHUNG YUL KYO;LEE JIN WON;JEONG JIN SOO
分类号 H05K1/03;H01R43/00 主分类号 H05K1/03
代理机构 代理人
主权项
地址