发明名称 Mikrowellenmodul
摘要 A Microwave Module in the form of a sealed enclosure comprising: a back of said enclosure, a cover of said enclosure, characterized in that a plurality of spring contacts are placed between said back and said cover, and by comprising a waveguide flange. ( Fig. 1 )
申请公布号 DE602007003031(D1) 申请公布日期 2009.12.10
申请号 DE20076003031T 申请日期 2007.11.26
申请人 SIAE MICROELETTRONICA S.P.A., COLOGNO MONZESE 发明人 MANFREDI, LEOPOLDO;FAVRE, GIULIO
分类号 H01P1/00;H01P5/107 主分类号 H01P1/00
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