发明名称 |
BAW RESONANCE DEVICE, AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a BAW resonance device enabling ruggedization without increasing parasitic capacity, and to provide a manufacturing method of the BAW resonance device. <P>SOLUTION: In the BAW resonance device, respective peripheries of respective etching holes 5, 5 in an insulating layer 4 are reinforced, and reinforcement sections 6, 6 made of a metal material electrically insulated from a resonator 3 are formed by twos. The reinforcement sections 6 are formed on both the surfaces in a thickness direction of the insulating layer 4 to respective etching holes 5; the reinforcement sections 6 formed at the side of a support substrate 1 in the insulating layer 4 is formed to the same thickness as that of a lower electrode 31 by the same metal material as that of the lower electrode 31; and the reinforcement section 6 formed at a side opposite to the side of the support substrate 1 in the insulating layer 4 is formed to the same thickness as that of an upper electrode 33 by the same metal material as that of the upper electrode 33. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009290364(A) |
申请公布日期 |
2009.12.10 |
申请号 |
JP20080138623 |
申请日期 |
2008.05.27 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
SHIRAI TAKEO;HAYAZAKI YOSHIKI;MATSUSHIMA CHOMEI;YOSHIHARA TAKAAKI;YAMAUCHI NORIHIRO |
分类号 |
H03H9/17;H01L41/09;H01L41/18;H01L41/22;H01L41/29;H01L41/319;H01L41/39;H03H3/02 |
主分类号 |
H03H9/17 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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