| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can minimize its height-directional size and can reduce its cost. <P>SOLUTION: In the semiconductor device, a second semiconductor chip 17 is bonded to a top surface 38A of a semiconductor integrated circuit 38 and to the upper portion of a first metal wire 15 for electrically connecting a first semiconductor chip 15 with a wiring substrate 11 via a bonding member 18. Also, a third semiconductor chip 21 is bonded to a top surface 42A of a semiconductor integrated circuit 42 and to the upper portion of a second metal wire 19 for electrically connecting a second semiconductor chip 17 to the wiring substrate 11 via a bonding member 22. <P>COPYRIGHT: (C)2010,JPO&INPIT |
