发明名称 |
SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE |
摘要 |
Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.
|
申请公布号 |
US2009303684(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
US20080132882 |
申请日期 |
2008.06.04 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
NATARAJAN GOVINDARAJAN;BEZAMA RASCHID J.;GARDELL DAVID L.;HUMENIK JAMES N. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|