| 摘要 |
FIELD: technological processes. ^ SUBSTANCE: this invention is related to the field of soldering, in particular to methods for soldering of parts made of stainless steel and may find application in machine building. Prior to assembly of parts, nickel coating is applied onto their soldered surfaces, and two annular bores are arranged on external surface of nozzle, where solder is placed. Internal diametre of cylindrical bush in area of soldered seam is arranged as less then required diametre. Assembled structure is placed into container, where reservoir with titanium chip is placed, and at the temperature of 200-300C, analysis of protective medium is carried out for availability of oxygen-containing gases in it. After required purity of protective gas is achieved in container, structure is heated up to temperature of solder melting, and structure cooling is started without time delay. Then it is withdrawn from container, and internal diametre of cylindrical bush is bored to required diametre, cutting the first annular bore at the same time. ^ EFFECT: production of high-quality soldered joint without gas bubbles and defects. ^ 6 cl, 1 ex, 3 dwg |
