| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a module with a built-in electronic part for forming a via hole conductor in a narrow pitch even when the module includes a built-in electronic part having a relative large height. <P>SOLUTION: This module includes: an insulating layer 120 in which electronic parts 131, 132 and an intermediary substrate 140 are embedded and a via hole conductor 182 electrically connected to the intermediary substrate 140 is formed; a wiring layer 161 formed in one side from the insulating layer 120 and electrically-connected to at least electronic parts 131, 132; and a wiring layer 163 formed in another side from the insulating layer 120, wherein the electronic part 131 and the wiring layer 163 are electrically connected via the intermediary substrate 140 and the via hole conductor 182. Since the wiring layers 161, 163 are connected via the intermediary substrate 140, the depth of the via hole conductor 182 is reduced. Thus, the opening diameter of the via hole is reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT |
