发明名称 |
MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACAKGE OF IMAGE-SENSING MODULE |
摘要 |
A manufacturing method of a wafer level chip scale package of an image-sensing module is provided. The method includes providing. a wafer having a plurality of die regions, and a plurality of sensing units is formed on a surface of the wafer in each die region. A plurality of lens units is formed on the sensing units, wherein each lens unit includes a lens and an edge wall that are integrally formed. A light-shielding film is also formed on a surface of at least one edge wall of at least one lens units. A dicing process is then performed on the wafer to form a plurality of image sensor chips.
|
申请公布号 |
US2009305451(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
US20090541153 |
申请日期 |
2009.08.13 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
HSUAN MIN-CHIH;KO TSUNG-HSI;CHEN LI-CHE |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|