| 摘要 |
PURPOSE: A light emitting diode lamp module and a manufacturing method thereof are provided to have good heat dissipation efficiency by having a heat sink with larger size than a circuit layer of a substrate on the circuit layer as simplifying the manufacturing process. CONSTITUTION: A heat sink(10) is formed with a metal or thermal conductivity material. At least one substrate includes a circuit and at least one opening revealing the heat sink. The circuit has smaller area than the heat sink, and is attached to the heat sink. At least one light emitting diode chip(30) is installed on the heat sink, and is electrically connected to the circuit of the substrate. An optical transmission packing material(40) protects a part of the substrate and the light emitting diode chip. |
