发明名称 METHOD FOR MANUFACTURING BAW RESONATOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a BAW resonator with which the bonding strength of a piezoelectric material part and a lower electrode can be enhanced and a Q value is also raised. <P>SOLUTION: The method for manufacturing the BAW resonator includes a bonding metal layer forming step of forming a bonding metal layer 31 on one surface in the thickness direction of a KNN element piece 30, a bonding step of bonding the bonding metal layer 31 and the lower electrode 2 laminated on one surface of a base substrate 1 thereafter, and an upper electrode forming step of forming an upper electrode 4 on the other surface side in the thickness direction of the KNN element piece 30 thereafter. When laminating the lower electrode 2 on one surface of the base substrate 1, after laminating a lower side metal layer 22 to be a lower layer in the lower electrode 2 on one surface of the base substrate 1, an upper side metal layer 21 to be an upper layer in the lower electrode 2 is laminated on the lower side metal layer 22. A metal of a density lower than that of the upper side metal layer 21 is used as the material of the lower side metal layer 22, and the metal of a bonding property with the bonding metal layer 31 higher than that of the lower side metal layer 22 is used as the material of the upper side metal layer 21. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009290374(A) 申请公布日期 2009.12.10
申请号 JP20080138688 申请日期 2008.05.27
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 YAMAUCHI NORIHIRO;SI-BEI XIONG;YOSHIHARA TAKAAKI;SHIRAI TAKEO;MATSUSHIMA CHOMEI;HAYAZAKI YOSHIKI
分类号 H03H3/02;H01L41/09;H01L41/18;H01L41/22;H01L41/29;H01L41/313;H01L41/314;H01L41/39;H03H9/17 主分类号 H03H3/02
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