| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has a capacitor formed on a semiconductor chip with a simple structure, and a semiconductor module using the semiconductor device. <P>SOLUTION: The semiconductor device has a semiconductor chip 13 having a semiconductor element formed and also having a plurality of electrodes electrically connected to the semiconductor element, a first insulating layer 20 formed on the semiconductor chip 13, a plurality of rearrangement wiring lines 22 formed on the first insulating layer 20 and electrically connected to the electrodes 14, a plurality of pads 23 formed at ends of the rearrangement wiring lines 22 and electrically connected to the outside, a second insulating layer 26 covering the rearrangement wiring lines 22 and pads 23, second openings 27 each formed by boring part of the second insulating layer 26 to expose part of a pad 23, and a dielectric layer 30 provided on a selected pad 23. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
