| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board that prevents progression of migration while sufficiently achieving the original purpose of containing a filler, and a semiconductor package. <P>SOLUTION: The wiring board includes an insulating layer, wirings formed on the insulating layer, and a solder resist layer formed on the insulating layer to cover at least part of the wirings, has the solder resist layer formed of a plurality of layers. The plurality of layers contain fillers differing in particle sizes, the layer thickness of the innermost layer forming the plurality of layers is larger than the layer thickness of the wirings, and the particle sizes of a filler contained in the innermost layer is smaller than the shortest interval between adjacent wirings. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
