发明名称 METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING MOUNTING STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board excellent in electrical reliability, and a method for manufacturing a mounting structure using the wiring board. <P>SOLUTION: The method for manufacturing the wiring board 2 includes: a process of arranging a protective member 3, which is made of resin and exposes a part of an upper surface of an insulating layer 7, on the insulating layer 7; a process of arranging a pressure member 11 contacting with an exposed part 7bx of a part of the exposed upper surface of the insulating layer 7; a process of heat crimping of the protective member 3 to the insulating layer 7 by pressing the protective member 3 and the pressure member 11 to an insulating layer 7 side while heating; and a process of exposing the exposed part 7bx of the upper surface of the insulating layer 7 by peeling the pressure member 11 from the upper surface of the insulating layer 7. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009289853(A) 申请公布日期 2009.12.10
申请号 JP20080138959 申请日期 2008.05.28
申请人 KYOCERA CORP 发明人 FUJISAKI AKIYA;HAYASHI KATSURA
分类号 H05K3/28;H05K3/46 主分类号 H05K3/28
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