| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal coating laminated body which has ample strength for forming stable flying lead, by using electrolytic copper foil and which can cope with the requirement for circuit miniaturization. Ž<P>SOLUTION: The metal coating laminated body is formed by laminating a copper foil layer formed by the electrolytic copper foil, a polyimide resin layer, and a stainless foil layer in this order. the average value of particle diameters in crystal particles of copper constituting the copper layer lies within the range of 0.5 to 3.0 μm, also difference of the average value and the maximum value of particle diameters in crystal particles is within a range of 2.0 μm or smaller. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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