| 摘要 |
Provided is a method for manufacturing a multilayer printed wiring board having a built-in electronic component and excellent connection reliability. High connection reliability is achieved with high positional accuracy of a solder bump (18), since the solder bump is formed by arranging an opening (16a) based on an alignment mark (14) arranged on a metal foil (12). Furthermore, since the solder bump (18) is arranged on the opening (16a) of a solder resist layer (16), the solder resist layer operates as a dam and the solder does not flow out in reflow. Thus, the fine-pitch solder bump (18) can be formed with high connection reliability. |
