| 摘要 |
<p>Provided is a manufacturing method for a semiconductor device, wherein the method comprises a coating step in which a paste of a heat-curable resin composition having flux activity is coated on at least one of a substrate or a semiconductor element, a connection step in which the substrate and the semiconductor element are electrically connected by the paste of a heat-curable resin composition, a curing step in which the paste of a heat-curable resin composition is heated and cured, and a cooling step in which cooling is performed at a cooling rate between 10°C/hour and 50°C/hour after the curing step.</p> |
