THROUGH WIRING BOARD, MULTILAYER THROUGH WIRING BOARD, METHOD OF MANUFACTURING THROUGH WIRING BOARD, AND METHOD OF MANUFACTURING MULTILAYER THROUGH WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a through wiring board which has thin through wiring, a multilayer through wiring board, method of manufacturing the through wiring board, and method of manufacturing the multilayer through wiring board. SOLUTION: The method of manufacturing the through wiring board includes a column formation body fabricating step of fabricating a column formation body having a flat plate portion made of silicon or metal and a plurality of column portions stood from one surface of the flat plate portion along the thickness of the flat plate portion, a filling step of filling gaps between the column portions of the column formation body with a resin or glass, a sealing body fabricating step of polishing both surfaces of the column formation body filled with the resin or the glass in the filling step along the thickness to fabricate the sealing body which has the column portions sealed with the resin or the glass and also has polished surfaces of the column portions exposed on both the surfaces, and an electrode forming step of forming an electrode over the polished surfaces of the column portions of the sealing body. The through wiring board is fabricated in this manufacturing method. COPYRIGHT: (C)2010,JPO&INPIT