| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device such that only when a test mode signal is input, a current is supplied to a conductor and a crack of a semiconductor chip is detected without newly providing a bonding pad for detecting the current flowing to the conductor; and to provide a crack detecting method for the semiconductor device. SOLUTION: The current flows to the conductor 15 in the absence of a crack, when the test mode signal is input to a crack detecting circuit 14 and a predetermined voltage is applied to a terminal A0. Here, the crack detecting circuit 14 includes the conductor 15 connected between: the drain of a PMOS transistor P1 having its gate connected to VSS and its source connected to the A0 terminal; and the drain of an NMOS transistor N1 having its gate connected to a test mode circuit and its source connected to the VSS. COPYRIGHT: (C)2010,JPO&INPIT |
