发明名称 RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive resin composition having good heat conductivity, excellent flame retardancy, and reduced mass loss ratio after left at high temperature for a long period of time. Ž<P>SOLUTION: A resin composition includes a heat conductive filler consisting of aluminum hydroxide and silicon dioxide, as well as a silicone resin, wherein the content of the heat conductive filler is 45-60 vol% based on the total volume of the resin composition and the content of the aluminum hydroxide is 30-50 mass% based on the total mass of the resin composition. In the resin composition, frequency maximum value in the particle distribution of the aluminum hydroxide is 5-70 μm, and the silicon dioxide is a crystalline silicon dioxide. A sheet of 0.3-5.0 mm thickness using the resin composition is also disclosed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009286809(A) 申请公布日期 2009.12.10
申请号 JP20060288072 申请日期 2006.10.23
申请人 DENKI KAGAKU KOGYO KK 发明人 SUGINO JUNJI;SAWA HIROAKI;SHIIBA MITSURU
分类号 C08L83/04;C08K3/22;C08K3/36 主分类号 C08L83/04
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