| 摘要 |
<p>The present invention relates to a sheet for perforation that is used for perforation processing, which is one of the processes of manufacturing a printed-circuit board. Specifically, the present invention relates to a sheet for perforation use, wherein an organic resin layer that contains an ethylene type copolymer, a polyolefin type resin with a low melting point, and a compatibilizer is laminated with a metal layer by means of a thermosetting adhesive, and a method for manufacturing a printed-circuit board comprising a process that arranges this sheet as a cover plate on the surface of the drill entry side of a printed-circuit board, on which one or more layers are laminated, and perforation is carried out using the drill.</p> |
