| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting condition determining method for a component mounting machine that improves the throughput of a production line. <P>SOLUTION: The mounting condition determining method that determines mounting conditions of the component mounting machine 200, which mounts components on a plurality of kinds of substrates conveyed on a plurality of conveyance lanes includes mounting substrate determination steps (S110, S114, and S116), in which how often a tool determined, based on the kind of a component mounted on a substrate conveyed on a conveyance lane and used to mount the component on the substrate conveyed on the conveyance lane by one mounting head is identical between two or more kinds of substrates among the plurality of kinds of substrates, is determined as a tool common degree and substrates that respective mounting heads should mount the components on are determined, based on the degree of commonality of the tool. <P>COPYRIGHT: (C)2010,JPO&INPIT |
