| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for forming a metal bump on a rail track face and an input-output pad thereof of a sealed semiconductor element in a flip-chip package. <P>SOLUTION: The method for forming a metal bump includes as main steps: a step of forming a metal layer under a bump on a top face of an input-output pad of a semiconductor element; a step of disposing an insulating layer and a metal foil in this order on the semiconductor element; a step of forming a conduction aperture to expose a top face of the metal layer under a bump; a step of forming a metal thin layer in the conduction aperture and forming an electric plating resist on the metal foil to expose only the conduction aperture; a step of passing an electric current to the metal foil and the metal thin layer in the conduction aperture to perform an electric plating and form a metal bump on the metal layer under a bump in the conduction aperture; and a step of removing the metal foil and the electric plating resist, wherein for a certain bump material, further a coating layer is formed on the metal bump. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
