| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same, both of which can reduce resin remained on a determining unit and can surely ooze out solder to the determining unit. SOLUTION: A semiconductor device 1 includes: a heat sink 2 having a surface 2A, a backside 2B faced thereto, and a determining unit 20 for determining solder wettability provided on a part of a side face 2C; a semiconductor chip 4 arranged on the surface 2A of the heat sink 2; a lead 5 electrically connected to a terminal 40 of the semiconductor chip 4; and a resin sealing portion 7 which exposes the backside 2B and the determining unit 20 of the heat sink 2 and covers the semiconductor chip 4, a part of the lead 5, and the surface 2A of the heat sink 2. The determining unit of the heat sink 2 is arranged at a position not beyond the outermost of the resin sealing portion 7; and a plating film 205, which has wettability with respect to solder extending from the surface 2A side to the backside 2B side of the heat sink 2 at part of the surface of the determining unit 20 and reduces adhesive force of resin of the resin sealing portion 7 as compared with another part of the determining unit 20, is provided. COPYRIGHT: (C)2010,JPO&INPIT
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