| 摘要 |
A semiconductor device includes a first metal post that has a first face, a second metal post that has a second face, a first plated layer that is provided on the first face, the first plated layer being discontiguous with an outer edge of the first face, a second plated layer that is provided on the second face, the second plated layer being discontiguous with an outer edge of the second face, an integrated circuit element that is fixed on the first face; a conductor that electrically connects the integrated circuit element with the second metal post, and a resin that seals the integrated circuit element and the conductor.
|
