| 摘要 |
A semiconductor device allowing for chip size reduction and thereby cost reduction without being restricted by a layout of bumps comprises a film substrate, an interposer substrate (3) made of silicon and mounted on the film substrate and a semiconductor element (2) mounted on the interposer substrate (3) in order to drive liquid crystals. The interposer substrate (3) includes a plurality of substrate projecting electrodes (5a, 5b, 5c) formed on its surface facing the semiconductor element (2), while the semiconductor element (2) includes a plurality of element projecting electrodes (4a, 4b, 4c) configured to be joined to the plurality of substrate projecting electrodes (5a, 5b, 5c), the plurality of element projecting electrodes (4a, 4b, 4c) being disposed throughout a surface of the semiconductor element (2).
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