发明名称 |
CLAMPING DEVICE FOR FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME |
摘要 |
A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.
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申请公布号 |
US2009300898(A1) |
申请公布日期 |
2009.12.10 |
申请号 |
US20090542123 |
申请日期 |
2009.08.17 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WU CHIN-JYI;TSAI CHEN-DER;TU YUN-CHUAN;WONG TE-CHI |
分类号 |
B23P11/00 |
主分类号 |
B23P11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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