| 摘要 |
A platinum-free and palladium-free conductive adhesive includes silver particles, additive metal particles and a binder. Components of the additive metal particles are selected from the group consisting of tungsten, niobium, tantalum and molybdenum etc., and do not contain platinum and palladium. The binder adheres the silver particles and the additive metal particles together. A specific weight percentage of the additive metal particles in a mixture of the silver particles and the additive metal particles ranges from 1 to 70. The presence of the additive metal particles can suppress silver migration. An electrode formed by the conductive adhesive is also disclosed.
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