摘要 |
An electrical contact (100) for connecting an electronic package with a circuit substrate comprise a first part (1) and a second part (2). The first part (1) comprises a body portion (11) and a first spring arm (14) extending upwardly from the body portion (11), the first spring arm (14) defines a first contacting portion (141) at top end thereof. The second part (2) comprises a retention portion (21), a second spring arm (23) extending upwardly from the retention portion (21) and a solder portion (22) extending downwardly from the retention portion (21), the second spring arm (21) defines a second contacting portion (231) at top end thereof and the body portion (11) is fastened on the retention portion (21).
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