发明名称 Wiring board, method of manufacturing wiring board, and liquid ejection head
摘要 The wiring board has electrical wires of a prescribed pattern. More specifically, the wiring board has a substrate on which grooves are formed in the prescribed pattern, each of the grooves having an undercut part; and a conductive material which is disposed inside the grooves so as to serve as the electrical wires.
申请公布号 US7630207(B2) 申请公布日期 2009.12.08
申请号 US20060520667 申请日期 2006.09.14
申请人 FUJIFILM CORPORATION 发明人 KOJIMA TOSHIYA
分类号 H05K7/00 主分类号 H05K7/00
代理机构 代理人
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