发明名称 Plasma processing method for forming a silicon nitride film on a silicon oxide film
摘要 A plasma processing method for forming a silicon nitride film on a silicon oxide film, the method including preparing a substrate on which the silicon oxide film is formed; generating plasma by supplying a nitrogen gas onto the silicon oxide film; and nitride-processing the silicon oxide film by the plasma so as to modify an upper portion of the silicon oxide film into the silicon nitride film.
申请公布号 US7629033(B2) 申请公布日期 2009.12.08
申请号 US20070785356 申请日期 2007.04.17
申请人 TOKYO ELECTRON LIMITED 发明人 HONGO TOSHIAKI;OSAWA TETSU
分类号 B01J19/08;H05H1/24;C23C8/24;C23C16/44;C23C16/455;C23C16/511;H01J37/32;H01L21/20;H01L21/302;H01L21/3065;H01L21/31 主分类号 B01J19/08
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