发明名称 Structure and process for a contact grid array formed in a circuitized substrate
摘要 An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.
申请公布号 US7628617(B2) 申请公布日期 2009.12.08
申请号 US20060525755 申请日期 2006.09.22
申请人 发明人 BROWN DIRK D.;WILLIAMS JOHN D.;LONG WILLIAM B.
分类号 H01R12/00 主分类号 H01R12/00
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