PROBE CARD FOR TESTING WAFER

摘要

PURPOSE: A probe card for testing wafer is provided to reduce the frequency noise and the test reliability by forming the printing portion of grid type around the circuit pattern. CONSTITUTION: The plurality of probe contacting the chip formed on the top of the printed circuit board is formed on the wafer. The circuit pattern(6) for electrically interlinking probe and test apparatus to the printed circuit board is formed. The printing portion(9) is formed in the part of the except of the circuit pattern not to be conducted with the circuit pattern. The printing portion is formed of the grid type into in width and length line. The width and length line are formed with the angle of 45 - 90° in order to contact each other.