| 摘要 |
Methods and apparatus for providing an integrated circuit (410) using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die (414) to a leadframe having a lead finger, attaching a wirebond (417) between the die (414) and the leadfinger, applying a first mold material over at least a portion of the wirebond (417) and the die (414) and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly. Embodiments comprise sensors with Hall effect (412) or magnetoresistive elements as well as a pole piece concentrators disposed on a backside of the assembly with a magnet. Such embodiments are used as gear tooth sensors. |
