发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: A PCB(Printed Circuit Board) and a manufacturing method thereof are provided to form a high-precision dam in an inkjet mode, thereby effectively controlling the flow of an under-fill solution. CONSTITUTION: A circuit pattern and a pad are formed in one side of a substrate(10). A solder resist layer(20) is formed in one side of the substrate so that the pad is exposed. A conductive material is printed on the pad in an ink jet printing mode. The surface(70) of the solder resist layer is plasma-processed. A dam(30) is formed over the solder resist layer in the ink jet printing mode in order to control the flow of an under-fill solution injected between the substrate and an electric element.</p>
申请公布号 KR20090125619(A) 申请公布日期 2009.12.07
申请号 KR20080051817 申请日期 2008.06.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JEONG, KYOUNG JIN;JOUNG, JAE WOO;YUN, KWAN SOO;LEE, RO WOON
分类号 H05K3/10;H05K3/30 主分类号 H05K3/10
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