| 摘要 |
<p>Provided are a resin composition whose storage stability does not deteriorate, a prepreg which uses the resin composition and is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as thermal shock test, and a semiconductor device. The resin composition is to be used for the multilayer printed wiring board and contains (A) a novolac-type epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a coloring substance. The exothermic peak temperature obtained by DSC measurement of the resin composition is within±5°C of the exothermic peak temperature of a resin composition composed of (A) a novolac-type epoxy resin, (B) a curing agent and (C) inorganic filler.</p> |
