| 摘要 |
<p>The field of the invention is that of the wiring of electromechanical micro-systems also called MEMS (the acronym standing for Micro Electro Mechanical Systems) and more particularly micro-systems carrying out measurements of physical quantities such as for example micro-gyrometers, micro-accelerometers or pressure micro-sensors. More precisely the subject of the invention is a wiring relay for an electromechanical micro-system enclosed in a protective package. A first end of a wire bond of electrically conducting material is fixed to the micro-system electrical contact. The relay is fixed to at least one internal wall. The relay consists of an electrically insulating material. According to the invention, it comprises tracks of electrically conducting material, and one track is linked electrically with at least one internal electrical contact and with a second end of a wire bond.</p> |
