| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide particle-dispersed fluid for polishing capable of performing two-stage polishing consisting of a polishing process at a relatively high polishing rate (a primary polishing process) and a precise polishing process (a secondary polishing process) with one kind of a polishing particle, and a polishing composition containing the same. <P>SOLUTION: The particle-dispersed fluid includes polishing particles (C) dispersed in a dispersion medium and having a mean particle diameter of 0.5-50μm obtained by heteroaggregating (A) 100 pts.mass of silica fine particles having a mean particle diameter (Da) of 4-150 nm and (B) 1-30 pts.mass of inorganic oxide fine particles having a mean particle diameter (Db) of 2-50 nm (wherein Da/Db≥2). The polishing composition contains the particle-dispersed fluid. A polishing method uses those. By utilizing the particle-dispersed fluid or the polishing composition, the polishing process at a high polishing rate (the primary polishing process) can be performed at a polishing pressure which does not cause a breakup of the polishing particles. Thereafter, at a polishing pressure in which the breakup of the polishing particles occurs, the precise polishing process (the secondary polishing process) can be performed by relatively fine particles generated by the breakup of the polishing particles. In other words, by using the particle-dispersed fluid or the polishing composition, one kind of the particle allows the primary and secondary polishing processes to be performed in a continuous manner. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
