| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has strong resistance against stress to be added to a lower part of an electrode pad when performing bonding, and facilitates arrangement of wiring. SOLUTION: At least two adjacent corners among four corners of the electrode pad 4 to be formed on a multilayer wiring layer 2 formed on the semiconductor substrate 1 are supported from below by supports 5a, 5b which penetrate the multilayer wiring layer 2 to reach the semiconductor substrate 1, a plurality of beams 6a, 6b, 6c are connected between the supports 5a and 5b, and members 7a, 7b, 7c, 7d are connected between the beams 6a and 6b. COPYRIGHT: (C)2010,JPO&INPIT |
