发明名称 ELECTROLYTIC ALLOY PLATING SOLUTION, AND PLATING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electrolytic alloy plating solution using no cyanide, which is applicable for hard gold plating and has good stability, and to provide an electrolytic alloy plating method using the same. SOLUTION: This electrolytic gold alloy plating solution contains a gold ion, at least one metal ion other than gold including nickel or cobalt, a sulfite other than gold sulfite, and a thiosulfate and/or a thiocyanate. The bath composition does not contain a cyanide. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009280867(A) 申请公布日期 2009.12.03
申请号 JP20080134377 申请日期 2008.05.22
申请人 KANTO CHEM CO INC 发明人 IWAI RYOTA;TOKUHISA TOMOAKI;KATO MASARU
分类号 C25D3/62;C25D3/56 主分类号 C25D3/62
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