| 摘要 |
A flip-chip package includes a package carrier; a semiconductor die having a die face and a die edge, the semiconductor die being assembled face-down to a chip side of the package carrier, and contact pads are situated on the die face; a rewiring laminate structure between the semiconductor die and the package carrier, the rewiring laminate structure including a re-routed metal layer, and at least a portion of the re-routed metal layer projects beyond the die edge; and bumps arranged on the rewiring laminate structure for electrically connecting the semiconductor die with the package carrier.
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