发明名称 METHOD FOR DETERMINING MOUNTING CONDITIONS, DEVICE FOR DETERMINING MOUNTING CONDITIONS, METHOD FOR MOUNTING COMPONENT AND MACHINE FOR MOUNTING COMPONENT
摘要 <p>Provided is a method for determining the mounting conditions of a component mounting machine so as to enhance throughput of production line. A method is provided for determining the mounting conditions of a component mounting machine (200) which mounts components on a plurality of kinds of substrates conveyed on a plurality of conveyance lanes.  The method comprises mounting substrate determination steps (S110, S114, S116) for determining a substrate to which one attachment head is to perform a component mounting work, based on a tool common degree.  The tool is determined depending on the type of the component to be mounted on the substrate being conveyed on a conveyance lane and the tool is used when one mounting head mounts the component on the substrate being transferred on the transfer lane.  The tool common degree is a degree of the tool being identical for two or more types of substrates out of a plurality of kinds of substrates.</p>
申请公布号 WO2009144908(A1) 申请公布日期 2009.12.03
申请号 WO2009JP02291 申请日期 2009.05.25
申请人 PANASONIC CORPORATION;MAENISHI, YASUHIRO 发明人 MAENISHI, YASUHIRO
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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