发明名称 |
SUBSTRATE FOR CERAMIC PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SUBSTRATE |
摘要 |
<p>Disclosed are a substrate for a ceramic printed circuit board and a method for manufacturing the substrate. The method for manufacturing the substrate of the present invention includes a step of forming an adhesive layer on a ceramic substrate through a sputtering method for physical vapor deposition, a step of depositing a first thin film, formed of conductive metal and having compressive residual stress, on the adhesive layer through a sputtering method, a step of depositing a second thin film, formed of conductive metal and having tensile residual stress, on the first thin film through a sputtering method, and a step of depositing a thick electrical conductive layer with total residual stress controlled within a preset range by repeating the steps of depositing the first thin film and the second thin film.</p> |
申请公布号 |
WO2009145461(A2) |
申请公布日期 |
2009.12.03 |
申请号 |
WO2009KR01672 |
申请日期 |
2009.04.01 |
申请人 |
KI-XIMAX CO., LTD.;KIM, KAB-SEOG;KIM, YONG-MO |
发明人 |
KIM, KAB-SEOG;KIM, YONG-MO |
分类号 |
H05K3/46;C23C14/35;H01L21/203 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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