MOLD CLAMPING DEVICE

摘要

A mold clamping device comprises a first platen on which one of a pair of metallic molds is fixed, a second platen on which the other of the pair of metallic molds is fixed and which can move in a mold open-close direction, and a rod which is fixed on the second platen and which transmits mold clamping force to the second platen from a side opposite to the first platen. The rod has a hollow structure. A ball screw mechanism for an ejector of a molded component is arranged in a hollow portion formed by the hollow structure. Thus, the mold clamping device capable of appropriately preventing the scattering of a lubricant which is for use in an ejector device is provided.